半导体

Logic and memory burn-in and test sockets feature innovative contact technology that gives more reliable electrical and mechanical interconnect. Contact design is optimized to minimize damage to the solder ball with lowest possible actuation force. Contacts open to allow package insertion for 0.5mm pitch and above. Several contact technologies, both through- hole and compression mount, are used for finer pitch packages < 0.5mm. Platform design gives ultimate flexibility in base sockets than can be used for different package sizes leveraging an adapter customized for specific customers’ packages. Changing an adapter to the socket is faster and lower cost than providing new sockets for each package size. Modifying base designs allows us to help customers choose the smallest socket footprint to maximize burn-in board capacity and through-put.

无液体热系统利用创新的相变技术在整个制造周期内在多个阶段进行半导体测试提供温度强迫范围从-55°C到250°C。相变技术可实现更安静的，具有快速稳定，卓越功能处理和精确控制的便携式测试解决方案。该行业最小的足迹中易于整合的热力强迫系统可以在您的测试环境中或用于生产自动测试设备中。热强迫系统可容纳各种设备尺寸和类型，无论是插座还是焊接。应用程序包括DUT级别的热管理，热流置换，温度强迫，处理程序集成，ATE测试，基准测试，系统级测试，高可靠性测试和OEM集成。

半导体automated test equipment (ATE) operates at high speed and power, requiring advancedliquid cooling systems。博伊德（Boyd）的创新液体冷却系统在测试半导体方面优化了最终质量控制，并具有最大的测试周期效率，可信赖的可靠性和最快的市场速度。液体冷板由有效的液体冷却系统和带有无颗粒，无毒的冷却器驱动Solimide®泡沫thermal insulation keep fluid lines cold so wafers and chips are tested at safe temperatures in pure environments. Optimized thermal management and insulation protects sensitive components from excessive heat loads and contaminants while decreasing thermal cycle test times.

综合直接芯片冷却解决方案了ge from air cooling to high efficiency liquid cooling and innovative immersion cooling development that maximize thermal density and enable higher processing power in the most compact format. Cool switch chips up to 2200 watts (W), GPUs up to 750W, and IGBTs up to 6KW now with continued research and development from Boyd to push power density and compute performance boundaries to the next level.

利用高性能风扇和鼓风机with remote热管热水槽高级组件, extreme air cooling can easily be routed to cool entire blades and racks in cloud applications while maximizing server density and using existing facility plumbing for efficient performance upgrades in current infrastructure. Liquid loops and liquid cold plates cooled by冷却液分配单元（CDU）或其他液体冷却系统可直接直接性能，可用于高级GPU，CPU和开关芯片的芯片液体冷却。自定义的天际线液体冷板创建了液体系统和处理器之间最有效的热接口，以最大程度地提高每个系统安装的热效率。这可以最大程度地提高系统性能和环境可持续性，同时使加工密度和更长的半导体寿命可用于销售性能差异。

精致的制造和自动化测试设备简化了生产过程中的质量保证，并且需要高性能工程材料解决方案才能达到的精度。纯，稳定和超平淡的材料有助于维持高质量，可靠的半导体所需的无污染物生产和测试环境。缓解振动，bob 体育网址 , thermal insulation, electrical isolation, high temperature bonding, FFKM o-rings, andEMI and RF shieldingprotect semiconductors during fabrication and testing to ensure accuracy and increase semiconductor chip yield.